PDF-Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc

Author : stefany-barnette | Published Date : 2015-08-25

2 Experimental Measurements This study reports measurements made with FCmBGA and FCLBGA packages as a function of heat sink size Both styles of packages have a 45mm

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Lidded Versus Bare Die Flip Chip Package: Impact on Thermal Performanc: Transcript

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