PPT-Emerging fine-pitch bump bonding techniques

Author : briana-ranney | Published Date : 2018-11-05

Sami Vaehaenen CERN PHESE LCDWG4 Vertex detector technology meeting 3September2010 1 Outline Introduction Solder bump evolution Elements amp trends Flip chip bonding

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Emerging fine-pitch bump bonding techniques: Transcript


Sami Vaehaenen CERN PHESE LCDWG4 Vertex detector technology meeting 3September2010 1 Outline Introduction Solder bump evolution Elements amp trends Flip chip bonding Introduction. By: Michelle . Lubrano. and Pat Hanson. Background of Volleyball Bump. A volleyball bump is also known as a pass. It is . the first contact with the ball following a serve from the other . team. It is usually hit close to the net so it can be set up for a spike. and . Electronegativity. Presented by . Leticia Bonita Prince. Newcastle University 4. th. Year . MChem. Student. Aims of Today. Increase your understanding of bonding and electronegativity. Increase your spatial skills and awareness using software designed by the CCDC. Sami Vaehaenen. – CERN PH-ESE . LCD-WG4 Vertex detector technology meeting. 3-September-2010. 1. Outline. Introduction. Solder bump evolution. Elements & trends. Flip chip bonding. Introduction. Co = Together. The Octet Rule. The octet rule says that all atoms want to have eight valence electrons, like the noble gases.. One way that atoms can follow the octet rule is by giving and taking electrons… ionic bonding. What types of things bond together?. Think-pair-share with your neighbor all of the things that bond together.. Share with entire class. What would happen if the bonds didn’t hold or were weak?. Bonding. Molecular Shapes. VSEPR Theory. From a correct Lewis structure, we can get to the 3-D shape using this theory.. VSEPR stands for . v. alence . s. hell . e. lectron . p. air . r. epulsion.. The theory is based on the idea that e- pairs want to get as far away from each other as possible!. . and Structure. IB Chemistry. Topic 4. . Bond - A force that holds . atoms . together and . makes . them . function as a . unit.. 4.1 Ionic Bonding. An . ion. is a charged particle. Ions form from atoms or from groups of atoms by . Higher Supported Study - Week 2 . Key Areas – Periodic Trends . The trends in . covalent radius . across periods and down groups.. The trends in . ionisation energies . across periods and down groups. . By Sharon Creech. Pictures by Harry Bliss. principal. The head of a school. The . principal. . of Bridge City Intermediate is a woman . named Dr. . Fountain. . . Soared. To rise or fly high in the air.. Count. Track balls and strikes in the order they are pitched. Example. First pitch = strike. Second pitch = ball. Third pitch = strike. Fourth pitch = batter gets one-base hit. Cumulative pitch count. 4.4.1: Describe the metallic bond as the electrostatic attraction between a lattice of positive ions and delocalized ions. . 4.4.2. : Explain the electrical conductivity and malleability of metals. . Fred Nobrega. September 4. , 201. 9. Coil Working Group Meeting. Introduction. QXFA115 CMM measurements indicate a bump on the coil about 0.09 mm above the coil outer surface that runs longitudinally about 2 m long and is about 5 turns wide on the transition side of the coil. . Dr. . Urfi. ?. COVID-19. Zika. AIDS . Avian Influenza. Ebola. Marburg . Cholera. Rift Valley Fever. Typhoid. Tuberculosis. Leptospirosis. Malaria . Chikungunya. Dengue, JE. Antimicrobial resistance. UP.  . Lesson Introduction – Orientation. This presentation will take you through . setting up bump and normal maps for the base V-Ray material . VRayMtl. This . information centers . around the parameters under the Bump and Normal mapping rollout for .

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