PPT-1 Lecture: Simba Topics: multi-chip-module design for scalable inference
Author : caroline | Published Date : 2023-09-19
2 MultiChipModule MCM A single package that includes multiple dies chips or chiplets 36 chiplets in this case reduces design cost The package substrate has
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1 Lecture: Simba Topics: multi-chip-module design for scalable inference: Transcript
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