PDF-For decades the semiconductor industry has used adhesive pastes to attach die to leadframes
Author : yoshiko-marsland | Published Date : 2015-02-21
Typically adhesive has been dispensed through needles from syringes or for smaller dots applied by the pintransfer method Some manufacturers notably in the automotive
Presentation Embed Code
Download Presentation
Download Presentation The PPT/PDF document "For decades the semiconductor industry h..." is the property of its rightful owner. Permission is granted to download and print the materials on this website for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.
For decades the semiconductor industry has used adhesive pastes to attach die to leadframes: Transcript
Download Document
Here is the link to download the presentation.
"For decades the semiconductor industry has used adhesive pastes to attach die to leadframes"The content belongs to its owner. You may download and print it for personal use, without modification, and keep all copyright notices. By downloading, you agree to these terms.
Related Documents