PDF-Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee

Author : tatyana-admore | Published Date : 2015-10-01

CPU Failure InvestigationEquipment Used x2022 Dye and Pry TechniqueConclusions Majority of failures cracks from mechanical bend overstress test observed at SolderChip

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"Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee"The content belongs to its owner. You may download and print it for personal use, without modification, and keep all copyright notices. By downloading, you agree to these terms.