PDF-Dye and Pry of BGA Solder Jointswww.cascade-eng.comReliability Enginee PDF document

CPU Failure InvestigationEquipment Used x2022 Dye and Pry TechniqueConclusions Majority of failures cracks from mechanical bend overstress test observed at SolderChip

Upload by tatyana-admore
Published on 2015-10-01

Presentation Embed Code

<iframe width="560" height="315" src="https://www.docslides.com/embed/146553" frameborder="0" allowfullscreen></iframe>

Download Presentation

Download Presentation The PPT/PDF document "Dye and Pry of BGA Solder Jointswww.casc..." is the property of its rightful owner. Permission is granted to download and print the materials on this web site for personal, non-commercial use only, and to display it on your personal computer provided you do not modify the materials and that you retain all copyright notices contained in the materials. By downloading content from our website, you accept the terms of this agreement.