PDF-Characterization and failure analysis of 3D integrated systems using a novel plasma FIB

Author : faustina-dinatale | Published Date : 2017-04-02

Therefore to address the analytical challenges in 3D technology and advanced packaging a novel high rate milling FIB system incorporating a Xe inductively coupled

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"Characterization and failure analysis of 3D integrated systems using a novel plasma FIB"The content belongs to its owner. You may download and print it for personal use, without modification, and keep all copyright notices. By downloading, you agree to these terms.